Monday - December 23, 2024

Fabrication Stack for High Integration Density Superconducting Digital Circuits

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- TRADING TECHNOLOGIES INTERNATIONAL, INC., Chicago, Illinois has been assigned a patent (No. US 12156484 B2, initially filed Dec. 23, 2021) developed by Anna Yurievna Herr, Leuven, Belgium, and Quentin Paul Herr, Leuven, Belgium, for "Fabrication stack for high integration density superconducting digital circuits." . . .

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Fabrication Stack for High Integration Density Superconducting Digital Circuits

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