Monday - December 23, 2024

Elastography for Ligament Characterization

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- SMITH & NEPHEW ASIA PACIFIC PTE. LIMITED, Singapore, Singapore has been assigned a patent (No. US 12150715 B2, initially filed June 28, 2023) developed by Brian W. McKinnon, Arlington, Tennessee, and Daniel Farley, Memphis, Tennessee, for "Elastography for ligament characterization." . . .

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Elastography for Ligament Characterization

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