Monday - December 23, 2024

Electronic Fuses With a Silicide Layer Having Multiple Thicknesses

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- GLOBALFOUNDRIES SINGAPORE PTE. LTD., Singapore, Singapore has been assigned a patent (No. US 12154854 B2, initially filed Jan. 7, 2022) developed by three inventors Shyue Seng Tan, Singapore, Singapore; George Mulfinger, Wilton, New York; and Eng Huat Toh, Singapore, Singapore, for "Electronic fuses with a silicide layer having multiple thicknesses." . . .

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Electronic Fuses With a Silicide Layer Having Multiple Thicknesses

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