Monday - December 23, 2024

Wedge-Shaped Multi-Layer Interlayer With Outer Skin Layers of Varying Thickness

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- SOLUTIA INC., St. Louis, Missouri has been assigned a patent (No. US 12151459 B2, initially filed Dec. 17, 2020) developed by six inventors Wenjie Chen, Amherst, Massachusetts; John Joseph D'Errico, Glastonbury, Connecticut; Lora Lee Spangler, Belchertown, Massachusetts; Gary Matis, Wilbraham, Massachusetts; Yalda Farhoudi, Longmeadow, Massachusetts; and Bruce Edward Wade, Gray, Tennessee, for "Wedge-shaped multi-layer interlayer with outer skin layers of varyin . . .

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Wedge-Shaped Multi-Layer Interlayer With Outer Skin Layers of Varying Thickness

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