Monday - December 23, 2024

Systems and Methods of 3d-Printing a Circuit Board on a Heat Sink Assembly Having Power Devices Bonded Thereto

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, Texas has been assigned a patent (No. US 12156344 B2, initially filed July 9, 2021) developed by Feng Zhou, Ann Arbor, Michigan, for "Systems and methods of 3D-printing a circuit board on a heat sink assembly having power devices bonded thereto." . . .

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Systems and Methods of 3d-Printing a Circuit Board on a Heat Sink Assembly Having Power Devices Bonded Thereto

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