Electrical Interface for Heat Pump
Copyright © Targeted News Service 2024
2024-11-26
ALEXANDRIA, Virginia, Nov. 26 -- DANDELION ENERGY, INC., New York, New York has been assigned a patent (No. US 12152795 B2, initially filed June 28, 2022) developed by three inventors Paul Ingemi, New York, New York; Dung Duc Nguyen, New York, New York; and John Dunn, New York, New York, for "Electrical interface for heat pump." . . .