Monday - December 23, 2024

Systems and Methods for Shaping Flexible Circuits to Improve Routing and Attachment

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- APTIV TECHNOLOGIES AG, Schaffhausen, Switzerland has been assigned a patent (No. US 12156342 B2, initially filed Aug. 17, 2022) developed by three inventors David G. Siegfried, Warren, Ohio; David R. Peterson, Aurora, Ohio; and Joseph Sudik, Jr., Niles, Ohio, for "Systems and methods for shaping flexible circuits to improve routing and attachment." . . .

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Systems and Methods for Shaping Flexible Circuits to Improve Routing and Attachment

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