Monday - December 23, 2024

Platform Outside Diameter Channel for Dual Supply Pressure Vane Applications

ALEXANDRIA, Virginia, Nov. 26 -- RTX CORPORATION, Farmington, Connecticut has been assigned a patent (No. US 12152501 B2, initially filed Oct. 3, 2022) developed by three inventors Rafael A. Perez Reisler, Arecibo, Oregon; Efrain Vega Rios, Manati, Oregon; and Andres Diaz Alvarado, Humacao, Oregon, for "Platform outside diameter channel for dual supply pressure vane applications." . . .

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