Monday - December 23, 2024

Microelectronic Devices Designed With Mold Patterning to Create Package-Level Components for High Frequency Communication Systems

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12155133 B2, initially filed April 11, 2023) developed by five inventors Feras Eid, Chandler, Arizona; Sasha N. Oster, Marion, Iowa; Telesphor Kamgaing, Chandler, Arizona; Georgios C. Dogiamis, Chandler, Arizona; and Aleksandar Aleksov, Chandler, Arizona, for "Microelectronic devices designed with mold patterning to create package-level components for high frequency communication syste . . .

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Microelectronic Devices Designed With Mold Patterning to Create Package-Level Components for High Frequency Communication Systems

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