Monday - December 23, 2024

Semiconductor Wafer and Method of Ball Drop on Thin Wafer With Edge Support Ring

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, Arizona has been assigned a patent (No. US 12154877 B2, initially filed Oct. 5, 2021) developed by three inventors Michael J. Seddon, Gilbert, Arizona; Takashi Noma, Ota, Japan; and Kazuhiro Saito, Ora-gun, Japan, for "Semiconductor wafer and method of ball drop on thin wafer with edge support ring." . . .

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Semiconductor Wafer and Method of Ball Drop on Thin Wafer With Edge Support Ring

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