Monday - December 23, 2024

Backside CMOS Trench Epi With Close N2P Space

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, New York has been assigned a patent (No. US 12154945 B2, initially filed Sept. 16, 2022) developed by four inventors Tao Li, Slingerlands, New York; Ruilong Xie, Niskayuna, New York; Julien Frougier, Albany, New York; and Nicolas Jean Loubet, Guilderland, New York, for "Backside CMOS trench epi with close N2P space." . . .

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Backside CMOS Trench Epi With Close N2P Space

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