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Methods of Forming Microelectronic Devices Including Tiered Stacks Including Conductive Structures Isolated by Slot Structures, and Related Microelectronic Devices and Electronic Systems

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12154825 B2, initially filed Sept. 13, 2021) developed by Raja Kumar Varma Manthena, Boise, Idaho, and Paolo Tessariol, Arcore, Italy, for "Methods of forming microelectronic devices including tiered stacks including conductive structures isolated by slot structures, and related microelectronic devices and electronic systems." . . .

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Methods of Forming Microelectronic Devices Including Tiered Stacks Including Conductive Structures Isolated by Slot Structures, and Related Microelectronic Devices and Electronic Systems

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