Monday - December 23, 2024

Three-Dimensional Bonding Scheme and Associated Systems and Methods

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12148736 B2, initially filed Feb. 3, 2022) developed by four inventors Kelvin Tan Aik Boo, Singapore, Singapore; Hong Wan Ng, Singapore, Singapore; Seng Kim Ye, Singapore, Singapore; and Chin Hui Chong, Singapore, Singapore, for "Three-dimensional bonding scheme and associated systems and methods." . . .

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Three-Dimensional Bonding Scheme and Associated Systems and Methods

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