Electromagnetic Compatibility Contact Between Metal Castings and Printed Circuit Boards
Copyright © Targeted News Service 2024
2024-11-19
ALEXANDRIA, Virginia, Nov. 19 -- HARMAN INTERNATIONAL INDUSTRIES, INC., Stamford, Connecticut has been assigned a patent (No. US 12150252 B2, initially filed March 31, 2023) developed by three inventors Jianing Chen, Northville, Michigan; Jon Curry, Commerce Township, Michigan; and David Jia, Canton, Michigan, for "Electromagnetic compatibility contact between metal castings and printed circuit boards." . . .