Monday - December 23, 2024

Semiconductor Packages and Associated Methods With Antennas and EMI Isolation Shields

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- Four inventors Owen R. Fay, Meridian, Idaho; Dong Soon Lim, Boise, Idaho; Randon K. Richards, Kuna, Idaho; and Aparna U. Limaye, Boise, Idaho, have been awarded a patent (No. US 12148711 B2, initially filed Nov. 11, 2021) for "Semiconductor packages and associated methods with antennas and EMI isolation shields." . . .

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Semiconductor Packages and Associated Methods With Antennas and EMI Isolation Shields

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