Monday - December 23, 2024

Flexible Vapor Chamber With Shape Memory Material

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12146476 B2, initially filed Dec. 23, 2021) developed by four inventors Jeff Ku, Taipei, Taiwan; Mark J. Gallina, Hillsboro, Oregon; Min Suet Lim, Penang, Malaysia; and Jianfang Zhu, Portland, Oregon, for "Flexible vapor chamber with shape memory material." . . .

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Flexible Vapor Chamber With Shape Memory Material

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