Monday - December 23, 2024

Integrated Assemblies Having Charge-Trapping Material Arranged in Vertically-Spaced Segments, and Methods of Forming Integrated Assemblies

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- Five inventors Byeung Chul Kim, Boise, Idaho; Francois H. Fabreguette, Boise, Idaho; Richard J. Hill, Boise, Idaho; Purnima Narayanan, Boise, Idaho; and Shyam Surthi, Boise, Idaho, have been awarded a patent (No. US 12150303 B2, initially filed April 24, 2023) for "Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies." . . .

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Integrated Assemblies Having Charge-Trapping Material Arranged in Vertically-Spaced Segments, and Methods of Forming Integrated Assemblies

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