Monday - December 23, 2024

Systems and Methods of Simulating Drop Shock Reliability of Solder Joints With a Multi-Scale Model

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- ANSYS, INC., Canonsburg, Pennsylvania has been assigned a patent (No. US 12147741 B1, initially filed June 20, 2023) developed by five inventors Cheng-Tang Wu, Livermore, California; Wei Hu, Mountain View, California; Dandan Lyu, Dublin, California; Siddharth Shah, Irvine, California; and Ashutosh Srivastava, Mountain View, California, for "Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model." . . .

Information Request Form

Name:
Category that best fits the type of business or agency you are affiliated with:	Government Newspaper / Media Business Public Policy Individual / Student Educators
Company Name:
Email:
Phone:
State:

I'd like to have a copy of this article mailed to me.

To also receive a free sample of other Targeted News products check the appropriate boxes below.
Golf Handicap site (FairwayFiles.com)
Products marked with ** can be customized by keywords or areas of interest. If you select them please specify your keywords in the box below:

If we need to contact you please specify your preferred contact method. Have a representative contact me by phone
Have a representative contact me via email

Additonal questions or comments:

Click here for more information or a free trial

Existing Customer Login

Systems and Methods of Simulating Drop Shock Reliability of Solder Joints With a Multi-Scale Model

Information Request Form

Copyright Targeted News Service 2024