Monday - December 23, 2024

Cleave Systems Having Spring Members for Cleaving a Semiconductor Structure and Methods for Cleaving Such Structures

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- GLOBALWAFERS CO., LTD., Hsinchu, Taiwan has been assigned a patent (No. US 12148635 B2, initially filed Sept. 29, 2022) developed by Justin Scott Kayser, Wentzville, Missouri, for "Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures." . . .

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Cleave Systems Having Spring Members for Cleaving a Semiconductor Structure and Methods for Cleaving Such Structures

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