Monday - December 23, 2024

Microelectronic Devices Having Air Gap Structures Integrated With Interconnect for Reduced Parasitic Capacitances

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- TAHOE RESEARCH, LTD., Dublin, Ireland has been assigned a patent (No. US 12148690 B2, initially filed Feb. 17, 2023) developed by four inventors Han Wui Then, Portland, Oregon; Sansaptak Dasgupta, Hillsboro, Oregon; Marko Radosavljevic, Portland, Oregon; and Sanaz K. Gardner, Hillsboro, Oregon, for "Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances." . . .

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Microelectronic Devices Having Air Gap Structures Integrated With Interconnect for Reduced Parasitic Capacitances

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