Monday - December 23, 2024

In-Process Wire Bond Testing Using Wire Bonding Apparatus

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- ATIEVA, INC., Newark, California has been assigned a patent (No. US 12148730 B2, initially filed Dec. 30, 2021) developed by three inventors Ben Carlson-Sypek, Chandler, Arizona; DodgieReigh M. Calpito, Fairfield, California; and Ryan Simpson, Maricopa, Arizona, for "In-process wire bond testing using wire bonding apparatus." . . .

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In-Process Wire Bond Testing Using Wire Bonding Apparatus

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