Monday - December 23, 2024

Memory Cell in Wafer Backside

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, New York has been assigned a patent (No. US 12148682 B2, initially filed Dec. 15, 2021) developed by six inventors Biswanath Senapati, Mechanicville, New York; Seiji Munetoh, Kawasaki, Japan; Nicholas Anthony Lanzillo, Wynantskill, New York; Lawrence A. Clevenger, Saratoga Springs, New York; Geoffrey Burr, Cupertino, California; and Kohji Hosokawa, Ohtsu, Japan, for "Memory cell in wafer backside." . . .

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Memory Cell in Wafer Backside

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