Monday - December 23, 2024

Semiconductor Device Assembly With Die Support Structures

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12148727 B2, initially filed Feb. 12, 2021) developed by Brandon P. Wirz, Boise, Idaho, and David R. Hembree, Boise, Idaho, for "Semiconductor device assembly with die support structures." . . .

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Semiconductor Device Assembly With Die Support Structures

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