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Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12150271 B2, initially filed June 8, 2023) developed by seven inventors Telesphor Kamgaing, Chandler, Arizona; Johanna M. Swan, Scottsdale, Arizona; Georgios Dogiamis, Chandler, Arizona; Henning Braunisch, Phoenix, Arizona; Adel A. Elsherbini, Chandler, Arizona; Aleksandar Aleksov, Chandler, Arizona; and Richard Dischler, Bolton, Massachusetts, for "Platforms including microelectronic . . .

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Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device

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