Monday - December 23, 2024

Downstop and Bump Bonds Formation on Substrates

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, New York has been assigned a patent (No. US 12150390 B2, initially filed July 22, 2022) developed by David Abraham, Croton, New York, and John Michael Cotte, New Fairfield, Connecticut, for "Downstop and bump bonds formation on substrates." . . .

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Downstop and Bump Bonds Formation on Substrates

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