Monday - December 23, 2024

Distributed Secure Array Using Intra-Dice Communications to Perform Data Attestation

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12149609 B2, initially filed March 4, 2022) developed by Alberto Troia, Munich, Germany, and Antonino Mondello, Messina, Italy, for "Distributed secure array using intra-dice communications to perform data attestation." . . .

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Distributed Secure Array Using Intra-Dice Communications to Perform Data Attestation

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