Monday - December 23, 2024

Plating and Deplating Currents for Material Co-Planarity in Semiconductor Plating Processes

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- APPLIED MATERIALS, INC., Santa Clara, California has been assigned a patent (No. US 12146235 B2, initially filed March 3, 2022) developed by six inventors Paul R. McHugh, Kalispell, Montana; Charles Sharbono, Whitefish, Montana; Jing Xu, Kalispell, Montana; John L. Klocke, Kalispell, Montana; Sam K. Lee, Kalispell, Montana; and Keith Edward Ypma, Kalispell, Montana, for "Plating and deplating currents for material co-planarity in semiconductor plating processes. . . .

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Plating and Deplating Currents for Material Co-Planarity in Semiconductor Plating Processes

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