Monday - December 23, 2024

Integrated Assemblies Having Voids Along Regions of Gates, and Methods of Forming Conductive Structures

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12150292 B2, initially filed Aug. 19, 2022) developed by Sanh D. Tang, Meridian, Idaho, for "Integrated assemblies having voids along regions of gates, and methods of forming conductive structures." . . .

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Integrated Assemblies Having Voids Along Regions of Gates, and Methods of Forming Conductive Structures

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