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Tiered-Profile Contact for Semiconductor

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, New York has been assigned a patent (No. US 12148663 B2, initially filed Nov. 9, 2021) developed by Kisik Choi, Watervliet, New York, and Kangguo Cheng, Schenectady, New York, for "Tiered-profile contact for semiconductor." . . .

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