Monday - December 23, 2024

Droop Mitigation for an Inter-Chiplet Interface

2024-11-19

ALEXANDRIA, Virginia, Nov. 19 -- ADVANCED MICRO DEVICES, INC., Santa Clara, California has been assigned a patent (No. US 12147366 B2, initially filed June 29, 2022) developed by Michael J. Tresidder, Austin, Texas, and Benjamin Tsien, Santa Clara, California, for "Droop mitigation for an inter-chiplet interface." . . .

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Droop Mitigation for an Inter-Chiplet Interface

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