Monday - December 23, 2024

Multitier Arrangements of Integrated Devices, and Methods of Forming Sense/Access Lines

2024-11-12

ALEXANDRIA, Virginia, Nov. 12 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12144188 B2, initially filed Jan. 20, 2023) developed by Lei Wei, Boise, Idaho, and Hongqi Li, Boise, Idaho, for "Multitier arrangements of integrated devices, and methods of forming sense/access lines." . . .

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Multitier Arrangements of Integrated Devices, and Methods of Forming Sense/Access Lines

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