Monday - December 23, 2024

CMP Polishing Pad With Enhanced Rate

2024-11-12

ALEXANDRIA, Virginia, Nov. 12 -- ROHM AND HAAS ELECTRONIC MATERIALS HOLDINGS, INC., Newark, Delaware has been assigned a patent (No. US 12138737 B2, initially filed March 31, 2021) developed by Mohammad T. Islam, Middletown, Delaware, for "CMP polishing pad with enhanced rate." . . .

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CMP Polishing Pad With Enhanced Rate

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