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Integrated Assemblies Having One or More Modifying Substances Distributed Within Semiconductor Material, and Methods of Forming Integrated Assemblies

2024-11-12

ALEXANDRIA, Virginia, Nov. 12 -- Three inventors John D. Hopkins, Meridian, Idaho; Purnima Narayanan, Boise, Idaho; and Jordan D. Greenlee, Boise, Idaho, have been awarded a patent (No. US 12144176 B2, initially filed June 15, 2021) for "Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assemblies." . . .

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Integrated Assemblies Having One or More Modifying Substances Distributed Within Semiconductor Material, and Methods of Forming Integrated Assemblies

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