Monday - December 23, 2024

3D Semiconductor Device and Structure With Bonding and Memory Cells Preliminary Class

2024-11-12

ALEXANDRIA, Virginia, Nov. 12 -- MONOLITHIC 3D INC., Klamath Falls, Oregon has been assigned a patent (No. US 12144190 B2, initially filed May 29, 2024) developed by three inventors Zvi Or-Bach, Haifa, Israel; Brian Cronquist, Klamath Falls, Oregon; and Deepak C. Sekar, Sunnyvale, California, for "3D semiconductor device and structure with bonding and memory cells preliminary class." . . .

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3D Semiconductor Device and Structure With Bonding and Memory Cells Preliminary Class

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