Tuesday - December 24, 2024

Wafer Stencil for Controlling Die Attach Material Thickness on Die

2024-11-12

ALEXANDRIA, Virginia, Nov. 12 -- TEXAS INSTRUMENTS INC., Dallas, Texas has been assigned a patent (No. US 12142549 B2, initially filed July 3, 2018) developed by Mario Alfonso Eduardo Magana, Sherman, Texas, for "Wafer stencil for controlling die attach material thickness on die." . . .

Information Request Form

Name:
Category that best fits the type of business or agency you are affiliated with:	Government Newspaper / Media Business Public Policy Individual / Student Educators
Company Name:
Email:
Phone:
State:

I'd like to have a copy of this article mailed to me.

To also receive a free sample of other Targeted News products check the appropriate boxes below.
Golf Handicap site (FairwayFiles.com)
Products marked with ** can be customized by keywords or areas of interest. If you select them please specify your keywords in the box below:

If we need to contact you please specify your preferred contact method. Have a representative contact me by phone
Have a representative contact me via email

Additonal questions or comments:

Click here for more information or a free trial

Existing Customer Login

Wafer Stencil for Controlling Die Attach Material Thickness on Die

Information Request Form

Copyright Targeted News Service 2024