Tuesday - December 24, 2024

Coreless Architecture and Processing Strategy for EMIB-based Substrates With High Accuracy and High Density

2024-11-12

ALEXANDRIA, Virginia, Nov. 12 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12142567 B2, initially filed April 17, 2019) developed by three inventors Xiao Di Sun Zhou, Tempe, Arizona; Debendra Mallik, Chandler, Arizona; and Xiaoying Guo, Chandler, Arizona, for "Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density." . . .

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Coreless Architecture and Processing Strategy for EMIB-based Substrates With High Accuracy and High Density

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