Tuesday - December 24, 2024

Transceiver and Interface for IC Package

2024-11-12

ALEXANDRIA, Virginia, Nov. 12 -- SAMTEC, INC., New Albany, Indiana has been assigned a patent (No. US 12140809 B2, initially filed April 14, 2023) developed by six inventors Eric J. Zbinden, New Albany, Indiana; Randall E. Musser, New Albany, Indiana; Jean-Marc A. Verdiell, New Albany, Indiana; John A. Mongold, New Albany, Indiana; Brian R. Vicich, New Albany, Indiana; and Keith R. Guetig, New Albany, Indiana, for "Transceiver and interface for IC package." . . .

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Transceiver and Interface for IC Package

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