Tuesday - December 24, 2024

Embedded System Module Thermal Installation Verification

Copyright © Targeted News Service 2024
2024-11-12
ALEXANDRIA, Virginia, Nov. 12 -- L3HARRIS TECHNOLOGIES, INC., Melbourne, Florida has been assigned a patent (No. US 12144118 B2, initially filed Oct. 6, 2021) developed by four inventors Craig K. Lyon, West Jordan, Utah; Craig R. Parker, Centerville, Utah; Christopher D. Jensen, Morgan, Utah; and Preston Balfour, South Jordan, Utah, for "Embedded system module thermal installation verification." . . .

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