Tuesday - December 24, 2024

Backside Power Distribution Network Semiconductor Package and Method of Manufacturing the Same

2024-11-12

ALEXANDRIA, Virginia, Nov. 12 -- SAMSUNG ELECTRONICS CO., LTD., Suwon-si, South Korea has been assigned a patent (No. US 12142564 B2, initially filed Aug. 28, 2023) developed by five inventors Saehan Park, Clifton Park, New York; Hoonseok Seo, Niskayuna, New York; Jeonghyuk Yim, Halfmoon, New York; Ki-Il Kim, Clifton Park, New York; and Gil Hwan Son, Clifton Park, New York, for "Backside power distribution network semiconductor package and method of manufacturing the same." . . .

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Backside Power Distribution Network Semiconductor Package and Method of Manufacturing the Same

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