Wednesday - December 25, 2024

Semiconductor Devices Including Stacked Dies With Interleaved Wire Bonds and Associated Systems and Methods

2024-11-05

ALEXANDRIA, Virginia, Nov. 5 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12136607 B2, initially filed April 11, 2022) developed by four inventors Koichi Kawai, Yokohama, Japan; Raj K. Bansal, Boise, Idaho; Takehiro Hasegawa, Yokohama, Japan; and Chang H. Siau, Saratoga, California, for "Semiconductor devices including stacked dies with interleaved wire bonds and associated systems and methods." . . .

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Semiconductor Devices Including Stacked Dies With Interleaved Wire Bonds and Associated Systems and Methods

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