Wednesday - December 25, 2024

Semiconductor Device Package and Manufacturing Method Thereof

2024-11-05

ALEXANDRIA, Virginia, Nov. 5 -- AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD., Singapore, Singapore has been assigned a patent (No. US 12136565 B2, initially filed Aug. 19, 2022) developed by four inventors Michael G. Kelly, Queen Creek, Arizona; Ronald Patrick Huemoeller, Gilbert, Arizona; Won Chul Do, Bucheon-si, South Korea; and David Jon Hiner, Chandler, Arizona, for "Semiconductor device package and manufacturing method thereof." . . .

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Semiconductor Device Package and Manufacturing Method Thereof

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