Wednesday - December 25, 2024

Heat Slug Attached to a Die Pad for Semiconductor Package

2024-11-05

ALEXANDRIA, Virginia, Nov. 5 -- TEXAS INSTRUMENTS INC., Dallas, Texas has been assigned a patent (No. US 12136588 B2, initially filed July 19, 2021) developed by Woochan Kim, San Jose, California, and Vivek Kishorechand Arora, San Jose, California, for "Heat slug attached to a die pad for semiconductor package." . . .

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Heat Slug Attached to a Die Pad for Semiconductor Package

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