Wednesday - December 25, 2024

Electronic Package With Interposer Between Integrated Circuit Dies

2024-11-05

ALEXANDRIA, Virginia, Nov. 5 -- QORVO US, INC., Greensboro, North Carolina has been assigned a patent (No. US 12136615 B2, initially filed Nov. 30, 2021) developed by four inventors Matthew Essar, Wylie, Texas; Curtis Miller, Wylie, Texas; Christopher Sanabria, Richardson, Texas; and Zhunming Du, Plano, Texas, for "Electronic package with interposer between integrated circuit dies." . . .

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Electronic Package With Interposer Between Integrated Circuit Dies

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