Wednesday - December 25, 2024

Physical Layer to Link Layer Interface and Related Systems, Methods and Devices

2024-11-05

ALEXANDRIA, Virginia, Nov. 5 -- MICROCHIP TECHNOLOGY INC., Chandler, Arizona has been assigned a patent (No. US 12137156 B2, initially filed Aug. 30, 2022) developed by four inventors Venkat Iyer, Austin, Texas; Dixon Chen, Guangdong, China; John Junling Zang, Guangdong, China; and Shivanand I. Akkihal, Austin, Texas, for "Physical layer to link layer interface and related systems, methods and devices." . . .

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Physical Layer to Link Layer Interface and Related Systems, Methods and Devices

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