Wednesday - December 25, 2024

Integrated Circuit Die Packages Including a Contiguous Heat Spreader

2024-11-05

ALEXANDRIA, Virginia, Nov. 5 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12136577 B2, initially filed June 25, 2020) developed by three inventors Feras Eid, Chandler, Arizona; Joe Walczyk, Tigard, Oregon; and Paul Diglio, Gaston, Oregon, for "Integrated circuit die packages including a contiguous heat spreader." . . .

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Integrated Circuit Die Packages Including a Contiguous Heat Spreader

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