Wednesday - December 25, 2024

Stackable Photonics Die With Direct Optical Interconnect

2024-11-05

ALEXANDRIA, Virginia, Nov. 5 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12135460 B2, initially filed Dec. 23, 2020) developed by four inventors Todd R. Coons, Hillsboro, Oregon; Michael Rutigliano, Hillsboro, Oregon; Joe F. Walczyk, Tigard, Oregon; and Abram M. Detofsky, Tigard, Oregon, for "Stackable photonics die with direct optical interconnect." . . .

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Stackable Photonics Die With Direct Optical Interconnect

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