Wednesday - December 25, 2024

Organometallic Photoresists for DUV or EUV Lithography

2024-11-05

ALEXANDRIA, Virginia, Nov. 5 -- INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, New York has been assigned a patent (No. US 12135503 B2, initially filed April 1, 2021) developed by three inventors Gerhard Ingmar Meijer, Zurich, Switzerland; Valery Weber, Gattikon, Switzerland; and Peter Willem Jan Staar, Zurich, Switzerland, for "Organometallic photoresists for DUV or EUV lithography." . . .

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Organometallic Photoresists for DUV or EUV Lithography

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