Wednesday - December 25, 2024

Multilayer Circuit Board

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2024-11-05
ALEXANDRIA, Virginia, Nov. 5 -- 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, Minnesota has been assigned a patent (No. US 12137521 B2, initially filed Feb. 24, 2021) developed by three inventors YunLong Qiao, Bukit Timah, Singapore; Saujit Bandhu, Sengkang, Singapore; and Kok Hoe Lee, Geylang, Singapore, for "Multilayer circuit board." . . .

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