Adhesive Composition
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2024-11-05
ALEXANDRIA, Virginia, Nov. 5 -- DDP SPECIALTY ELECTRONIC MATERIALS US, LLC, Wilmington, Delaware has been assigned a patent (No. US 12134716 B2, initially filed Feb. 20, 2019) developed by three inventors Sergio Grunder, Freienbach, Switzerland; Stefan Schmatloch, Freienbach, Switzerland; and Joel Kunz, Horgen, Switzerland, for "Adhesive composition." . . .