Wednesday - December 25, 2024

Integrated Assemblies Having Body Contact Regions Proximate Transistor Body Regions; And Methods Utilizing Bowl Etches During Fabrication of Integrated Assemblies

2024-11-05

ALEXANDRIA, Virginia, Nov. 5 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12137551 B2, initially filed Sept. 22, 2022) developed by Werner Juengling, Meridian, Idaho, for "Integrated assemblies having body contact regions proximate transistor body regions; and methods utilizing bowl etches during fabrication of integrated assemblies." . . .

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Integrated Assemblies Having Body Contact Regions Proximate Transistor Body Regions; And Methods Utilizing Bowl Etches During Fabrication of Integrated Assemblies

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